A prediction for fatigue crack growth rate in diffusion bonded Al/Ti interface

초록

A melt diffusion bonding technique was developed to make a joint of Ti and Al, which had been regarded as almost impossible because of high activity. Fatigue crack growth rates, da/dN of the Al/Ti interfaces were measured experimentally at various stress ratios and compared with pure Ti and Al. The interface showed a resistance to fatigue crack propagation as good as that of aluminum alloy. The proposed universal equations on the basis of the crack closure concept made it possible to predict da/dN for various ΔK and R. Fatigue crack was observed to grow in the Al side adjacent to the interface along the direction parallel to the interface. It was observed to form the intermetallic compounds in the interface region.

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