Remote 플라즈마에서 위치 및 반응기체에 따른 PMMA의 식각 특성 분석

초록

Etching process of PMMA (Polymethyl Methacrylate) on glass surface was investigated by dry etchingtechnique using remote plasma. To determine the etching characteristics, the remote plasma etching was conducted forfrom the plasma generation was increased, the etch rate of PMMA was linearly decreased by radical density in plasma.PMMA has removed by reactive radicals in the plasma. The etch rate increased with plasma power because of morereactive radicals. The etch rate and surface roughness of PMMA increased with O2 concentration in the etchant.

키워드