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A Study on the Ta Layer as the Diffusion Barrier in Copper Metallization

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A Study on the Ta Layer as the Diffusion Barrier in Copper Metallization
저자
이성만
발행일
1994-01
개최국가
대한민국
학회 개최일
1994-01 ~ 1994-01

ScholarWorks@강원대학교

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