WS2 윤활제를 첨가한 마이크로 다이아몬드 블레이드의 절삭성능과 기계적 특성

초록

WS2 powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of WS2 additive on cutting efficiency was investigated and compared with the micro-blades with MoS2 developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with WS2 but wear depth increased. It was found that the blades including WS2 consumed less momentary energy than the blades containing MoS2 during dicing test. Micro-blades containing WS2 exhibited lower flexural strength than the blades with MoS2 resulting from higher amount of sintering defects relevant to the less effectiveness of WS2 on fluidity. The effect of WS2and MoS2 on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.%of WS2 showed the best cutting efficiency.

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