Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation

Han, Seung Zeon; Joh, Hongrae; Ahn, Jee Hyuk; Lee, Jehyun; Kim, Sang Min; Lim, Sung Hwan; Son, Young Guk

doi:10.1016/j.jallcom.2014.10.031

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Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation

Han, Seung Zeon;
Joh, Hongrae;
Ahn, Jee Hyuk;
Lee, Jehyun;
Kim, Sang Min;
... Lim, Sung Hwan;
외 1명

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초록

Two types of alumina dispersion-strengthened Cu alloy were fabricated by surface oxidation reaction by the aging of Cu-0.31 wt%Al and Cu-0.28 wt%Al-0.07 wt%Ti alloys in air. After heat treatment at 980 degrees C for 1 h in air, a 0.2 mm-thick alumina-dispersed plate could be prepared. The alumina-dispersed alloy with Ti addition showed higher values of conductivity, hardness, and tensile strength than the alloy without Ti. (C) 2014 Elsevier B.V. All rights reserved.

키워드

Alumina; Dispersion strengthening; High conductivity; High strength; Surface oxidation; COPPER-MATRIX COMPOSITES; MICROSTRUCTURE

제목: Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation

저자: Han, Seung Zeon; Joh, Hongrae; Ahn, Jee Hyuk; Lee, Jehyun; Kim, Sang Min; Lim, Sung Hwan; Son, Young Guk

DOI: 10.1016/j.jallcom.2014.10.031

발행일: 2015-02-15

유형: Article

저널명: Journal of Alloys and Compounds

권: 622

페이지: 384 ~ 387