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Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation
- Han, Seung Zeon;
- Joh, Hongrae;
- Ahn, Jee Hyuk;
- Lee, Jehyun;
- Kim, Sang Min;
- ... Lim, Sung Hwan;
- 외 1명
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25초록
Two types of alumina dispersion-strengthened Cu alloy were fabricated by surface oxidation reaction by the aging of Cu-0.31 wt%Al and Cu-0.28 wt%Al-0.07 wt%Ti alloys in air. After heat treatment at 980 degrees C for 1 h in air, a 0.2 mm-thick alumina-dispersed plate could be prepared. The alumina-dispersed alloy with Ti addition showed higher values of conductivity, hardness, and tensile strength than the alloy without Ti. (C) 2014 Elsevier B.V. All rights reserved.
키워드
Alumina; Dispersion strengthening; High conductivity; High strength; Surface oxidation; COPPER-MATRIX COMPOSITES; MICROSTRUCTURE
- 제목
- Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation
- 저자
- Han, Seung Zeon; Joh, Hongrae; Ahn, Jee Hyuk; Lee, Jehyun; Kim, Sang Min; Lim, Sung Hwan; Son, Young Guk
- 발행일
- 2015-02-15
- 유형
- Article
- 권
- 622
- 페이지
- 384 ~ 387
- 언어
- ENG
- 출판사
- ELSEVIER SCIENCE SA
- 발행국가
- 스위스
- 분량
- 4 페이지
- ISSN
- E 1873-4669
P 0925-8388