A study on thermal shock of ceramic monolithic substrate

초록

Technical ceramics, due to their unique physical properties, are excellent candidate materials for engineering applications involving extreme thermal and chemical environments. When ceramics are rapidly cooled, they receive thermal shock. The thermal shock parameter is defined as the critical temperature difference. The critical temperature difference for ceramic parts is influenced by its size, the convective heat transfer coefficient, etc. The thermal shock for a component is analyzed by using the transient thermal stress. If the transient thermal stress exceeds the modulus of rupture (MOR), cracking by thermal shock is initiated. The critical temperature difference for water is less than the critical temperature difference for air. The three-way catalyst substrate used in this study has an adequate performance against thermal shock because its radial and axial temperature differences existed below the critical temperature differences.

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