Preparation of Thermosetting Polyimide Adhesive Film for the Manufacture of High-Performance Probe Card Containing Fine Pitch Probe

초록

With the increasing demand for high-performance and miniaturized semiconductors, the need for high-performance semiconductor test consumables is also growing. High-density probe cards, such as those used for memory semiconductors with fine pitches and over 100,000 pins, require high-density interconnections with integrated circuits (ICs). To prevent signal distortion, it is essential to form additional multilayer thin films on multilayer ceramics. In this study, a polyimide-based thermosetting adhesive film was developed, which maintains high heat resistance under high-temperature thermocompression bonding conditions and enables direct adhesion between multilayer ceramics and multilayer thin films without additional surface treatment. A reactive polyimide capable of chemically reacting with epoxy resin was synthesized using a chemical imidization method. The polyimide-based thermosetting adhesive film was then prepared by blending the synthesized reactive polyimide with epoxy resin. The physical properties of the fabricated polyimide-based adhesive films were analyzed based on variations in the molar ratio of monomers. Additionally, the adhesion strength of the films to alumina substrates and flexible copper-clad laminates was evaluated.

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