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Two-dimensional correlation analysis study of the curing process of phenylethynyl end-capped imide model compounds
- Chae, Boknam;
- Lee, Sang Hyun;
- Kim, Seung Bin;
- Jung, Young Mee;
- Lee, Seung Woo
WEB OF SCIENCE
5SCOPUS
5초록
The phenylethynyl end-capped imide model compounds 6F-PDA-PEAP and 6F-ODA-PEAP were prepared for detailed investigation of the thermal cure process. To probe the spectral changes of ethynyl C C moieties as well as imide rings and phenyl rings in PDA and ODA units during the thermal curing, we applied two-dimensional (2D) correlation analysis to the infrared spectra of 6F-PDA-PEAP and 6F-ODA-PEAP films. Thermal curing of 6F-PDA-PEAP and 6F-ODA-PEAP was influenced by molecular structure, and it induced spectral changes of C C moieties as well as imide rings and phenyl rings in PDA and ODA units. The thermal curing of 6F-PDA-PEAP and 6F-ODA-PEAP films induces the intensity changes of bands of imide and phenyl rings in PDA and ODA units before that of C C moieties. (C) 2011 Elsevier B.V. All rights reserved.
키워드
- 제목
- Two-dimensional correlation analysis study of the curing process of phenylethynyl end-capped imide model compounds
- 저자
- Chae, Boknam; Lee, Sang Hyun; Kim, Seung Bin; Jung, Young Mee; Lee, Seung Woo
- 발행일
- 2012-05
- 유형
- Article
- 권
- 60
- 페이지
- 137 ~ 141