Two-dimensional correlation analysis study of the curing process of phenylethynyl end-capped imide model compounds

Citations

WEB OF SCIENCE

5
Citations

SCOPUS

5

초록

The phenylethynyl end-capped imide model compounds 6F-PDA-PEAP and 6F-ODA-PEAP were prepared for detailed investigation of the thermal cure process. To probe the spectral changes of ethynyl C C moieties as well as imide rings and phenyl rings in PDA and ODA units during the thermal curing, we applied two-dimensional (2D) correlation analysis to the infrared spectra of 6F-PDA-PEAP and 6F-ODA-PEAP films. Thermal curing of 6F-PDA-PEAP and 6F-ODA-PEAP was influenced by molecular structure, and it induced spectral changes of C C moieties as well as imide rings and phenyl rings in PDA and ODA units. The thermal curing of 6F-PDA-PEAP and 6F-ODA-PEAP films induces the intensity changes of bands of imide and phenyl rings in PDA and ODA units before that of C C moieties. (C) 2011 Elsevier B.V. All rights reserved.

키워드

Phenylethynyl end-capped imide model compoundsThermal cureFTIR spectroscopyTwo-dimensional correlation analysisSEGMENTAL REORIENTATIONSCORRELATION SPECTROSCOPYBRUSH POLYIMIDETHERMAL CUREOLIGOMERSSEQUENCESURFACEFILMSRAMAN
제목
Two-dimensional correlation analysis study of the curing process of phenylethynyl end-capped imide model compounds
저자
Chae, BoknamLee, Sang HyunKim, Seung BinJung, Young MeeLee, Seung Woo
DOI
10.1016/j.vibspec.2011.10.014
발행일
2012-05
유형
Article
저널명
Vibrational Spectroscopy
60
페이지
137 ~ 141