표면 부식 처리한 WS2 입자를 첨가한 Cu/Sn계 다이아몬드 마이크로 블레이드의 절삭특성

초록

WS2 particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added WS2 lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of WS2 lubricant particles were etched for activating the surface of WS2 particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between WS2 particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including WS2 were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

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