Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound

  • Han, Seung Zeon
  • Lim, Sung Hwan
  • Kim, Sangshik
  • Lee, Jehyun
  • Goto, Masahiro
  • 외 3명
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초록

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.

키워드

MECHANICAL-PROPERTIESMICROSTRUCTURE
제목
Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound
저자
Han, Seung ZeonLim, Sung HwanKim, SangshikLee, JehyunGoto, MasahiroKim, Hyung GiunHan, ByungchanKim, Kwang Ho
DOI
10.1038/srep30907
발행일
2016-08-04
유형
Article
저널명
Scientific Reports
6