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Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys
- Kim, Hyung Giun;
- Lee, Taeg Woo;
- Kim, Sang Min;
- Han, Seung Zeon;
- Euh, Kwangjun;
- ... Lim, Sung Hwan;
- 외 1명
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The mechanical and electrical properties of Cu-5.98Ni-1.43Si and Cu-5.98Ni-1.29Si-0.24Ti alloys under heat treatment at 400 and 500 A degrees C after hot- and cold-rolling were investigated, and a microstructural analysis using transmission electron microscopy was performed. Cu-5.98Ni-1.29Si-0.24Ti alloy displayed the combined Vickers hardness/electrical conductivity value of 315.9 Hv/57.1%IACS. This was attributed to a decrease of the solution solubility of Ni and Si in the Cu matrix by the formation of smaller and denser delta-Ni2Si precipitates. Meanwhile, the alloyed Ti was detected in the coarse Ni-Si-Ti phase particles, along with other large Ni-Si phase particles, in Cu-5.98Ni-1.29Si-0.24Ti.
키워드
alloys; thermomechanical processing; microstructure; precipitation; transmission electron microscopy; MICROSTRUCTURE; STRENGTH; PRECIPITATION; CONDUCTIVITY; BEHAVIOR
- 제목
- Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys
- 저자
- Kim, Hyung Giun; Lee, Taeg Woo; Kim, Sang Min; Han, Seung Zeon; Euh, Kwangjun; Kim, Won Yong; Lim, Sung Hwan
- 발행일
- 2013-01
- 유형
- Article
- 권
- 19
- 호
- 1
- 페이지
- 61 ~ 65