Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys

  • Kim, Hyung Giun; 
  • Lee, Taeg Woo; 
  • Kim, Sang Min; 
  • Han, Seung Zeon; 
  • Euh, Kwangjun; 
  • ... Lim, Sung Hwan; 
  • 외 1명
Citations

WEB OF SCIENCE

31
Citations

SCOPUS

39

초록

The mechanical and electrical properties of Cu-5.98Ni-1.43Si and Cu-5.98Ni-1.29Si-0.24Ti alloys under heat treatment at 400 and 500 A degrees C after hot- and cold-rolling were investigated, and a microstructural analysis using transmission electron microscopy was performed. Cu-5.98Ni-1.29Si-0.24Ti alloy displayed the combined Vickers hardness/electrical conductivity value of 315.9 Hv/57.1%IACS. This was attributed to a decrease of the solution solubility of Ni and Si in the Cu matrix by the formation of smaller and denser delta-Ni2Si precipitates. Meanwhile, the alloyed Ti was detected in the coarse Ni-Si-Ti phase particles, along with other large Ni-Si phase particles, in Cu-5.98Ni-1.29Si-0.24Ti.

키워드

alloys; thermomechanical processing; microstructure; precipitation; transmission electron microscopy; MICROSTRUCTURE; STRENGTH; PRECIPITATION; CONDUCTIVITY; BEHAVIOR
제목
Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys
저자
Kim, Hyung Giun; Lee, Taeg Woo; Kim, Sang Min; Han, Seung Zeon; Euh, Kwangjun; Kim, Won Yong; Lim, Sung Hwan
DOI
10.1007/s12540-013-1011-8
발행일
2013-01
유형
Article
저널명
Metals and Materials International
권
19
호
1
페이지
61 ~ 65