Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics

  • Kim, Sang Il
  • Lee, Kyu Hyoung
  • Mun, Hyeon A.
  • Kim, Hyun Sik
  • Hwang, Sung Woo
  • 외 7명
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초록

The widespread use of thermoelectric technology is constrained by a relatively low conversion efficiency of the bulk alloys, which is evaluated in terms of a dimensionless figure of merit (zT). The zT of bulk alloys can be improved by reducing lattice thermal conductivity through grain boundary and point-defect scattering, which target low-and high-frequency phonons. Dense dislocation arrays formed at low-energy grain boundaries by liquid-phase compaction in Bi0.5Sb1.5Te3 (bismuth antimony telluride) effectively scatter midfrequency phonons, leading to a substantially lower lattice thermal conductivity. Full-spectrum phonon scattering with minimal charge-carrier scattering dramatically improved the zT to 1.86 +/- 0.15 at 320 kelvin (K). Further, a thermoelectric cooler confirmed the performance with a maximum temperature difference of 81 K, which is much higher than current commercial Peltier cooling devices.

키워드

LATTICE THERMAL-CONDUCTIVITYBI2TE3POWER
제목
Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics
저자
Kim, Sang IlLee, Kyu HyoungMun, Hyeon A.Kim, Hyun SikHwang, Sung WooRoh, Jong WookYang, Dae JinShin, Weon HoLi, Xiang ShuLee, Young HeeSnyder, G. JeffreyKim, Sung Wng
DOI
10.1126/science.aaa4166
발행일
2015-04-03
유형
Article
저널명
Science
348
6230
페이지
109 ~ 114