Microstructure and physical properties of silicon dioxide/wood composite

초록

In order to completely know the microstructure and physical characteristics of silicon dioxide/wood composites, X-ray diffraction (XRD) and energy dispersive X-ray analyzer (EDAX) are used for studying the micro-structure of silicon dioxide/wood composites made by sol-gel. Stress relaxation, dielectric properties, thermogravimetry and surface microhardness mensurating methods are used for analyzing their physical properties. The results show that silicon dioxide exists in the cell wall of wood for silicon dioxide/wood composites made by the wood of moisture content under the fibre saturation point. Crystallintty decreases, while the mole fraction of silicon dioxide increases with the enhancement of mass gain. The position of XRD spectra peak is the same as the untreatment. The magnitude of stress relaxation of silicon dioxide/wood composites is less than the untreatment. There is a cross-linking between wood molecule and silicon dioxide. The dielectric constant decreases, while the dielectric loss factor increases firstly, then decreases with increasing frequency. The frequency of the dielectric loss factor reaching the maximum value is in the vicinity of log f=6.5 Hz at room temperature. The start temperature of fast thermogravimetry of the silicon dioxide/wood composites rises in the thermogravimetry course, their remainder mass increases in the end, and their surface microhardness increases.

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