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Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
- Choi, Mi-Ri;
- Kim, Hyung-Giun;
- Lee, Taeg-Woo;
- Jeon, Young-Jun;
- Ahn, Yong-Keun;
- ... Lim, Sung-Hwan;
- 외 8명
WEB OF SCIENCE
17SCOPUS
20초록
We found the failure mechanisms in Ag wire bonded to Al pads during the high-temperature-storage lifetime test (HTST) and the unbiased highly-accelerated temperature and humidity storage test (uHAST). The native oxide layer on the Al pads caused a ball lift The moisture and the thermal energy during uHAST along with the Cl- ion in epoxy molding compounds (EMCs) induced repetitive oxidation and reduction reactions of the Ag-Al intermetallic compounds (IMCs) with the Al pads. These repetitive reactions formed H-2 gas as a by-product causing the formation of a micro-crack. In addition, the alumina layer acted as a resistive layer in the Ag-Al IMCs. The phases of the Ag-Al IMCs were identified as Ag2Al and Ag3Al, and the growth rates of those IMCs were measured at 150 and 175 degrees C for 2000 h. (C) 2015 Elsevier Ltd. All rights reserved.
키워드
- 제목
- Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
- 저자
- Choi, Mi-Ri; Kim, Hyung-Giun; Lee, Taeg-Woo; Jeon, Young-Jun; Ahn, Yong-Keun; Koo, Kyo-Wang; Jang, You-Cheol; Park, So-Yeon; Yee, Jae-Hak; Cho, Nam-Kwon; Kang, Il-Tae; Kim, Sangshik; Han, Seung-Zeon; Lim, Sung-Hwan
- 발행일
- 2015-11
- 유형
- Article
- 권
- 55
- 호
- 11
- 페이지
- 2306 ~ 2315