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기초조형학연구
ISSN
P 1598-8635 E 2713-5993
출판사
한국기초조형학회
국가
SOUTH KOREA
발행 상태
비활성
데이터베이스 수록 정보
KCI 2009-2025 (17년)
KCI 등재 2006-2026 (21년)
KCI 등재후보 2003-2005 (3년)
전체 12건 중 1번부터 10번까지의 결과를 표시합니다.
2025
Article
Effect of Sn-58Bi (SB) and Sn-3Ag-0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-12-22
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers
- Baek, Yi Hyeon ;
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-12-21
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-10-21
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2024
Article
Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers
- Ha, Yi Hyeon ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2024-11
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Phase formation and superconducting properties of (Tl,M)(Sr, Ba)Ca3Cu4Oz compounds with M = Ca, Mg, and Cu
- Lee, Ho Keun ;
- Park, Sangmin ;
- Seo, Ji Won ;
- Abd-Shukor, Roslan
- 2024-03
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2023
Article
Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers
- Ha, Min Jeong ;
- Lee, Jeong, II ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-09
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)
- Youn, Hee Jun ;
- Lee, Jeong Il ;
- Ha, Min Jeong ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-04
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler
- Ha, Min Jeong ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-04
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2022
Article
Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites
- Youn, Hee Jun ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2022-05
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2020
Article
Facile CuFeO2 microcrystal synthesis for lithium ion battery anodes via microwave heating
- Kim, Jun-Hyuk ;
- Kim, Jae Young ;
- Choi, Yo Han ;
- Youn, Duck Hyun
- 2020-06
- Journal of Materials Science: Materials in Electronics
- SPRINGER
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