기초조형학연구

ISSN
P 1598-8635 E 2713-5993
출판사
한국기초조형학회
국가
SOUTH KOREA
발행 상태
비활성

데이터베이스 수록 정보

KCI 2009-2025 (17년)
KCI 등재 2006-2026 (21년)
KCI 등재후보 2003-2005 (3년)

전체 12건 중 1번부터 10번까지의 결과를 표시합니다.

2025
Article

Effect of Sn-58Bi (SB) and Sn-3Ag-0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder

  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Baek, Yi Hyeon
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2025-12-22
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers

  • Baek, Yi Hyeon
  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2025-12-21
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder

  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Baek, Yi Hyeon
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2025-10-21
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
2024
Article

Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers

  • 2024-11
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Phase formation and superconducting properties of (Tl,M)(Sr, Ba)Ca3Cu4Oz compounds with M = Ca, Mg, and Cu

  • Lee, Ho Keun
  • Park, Sangmin
  • Seo, Ji Won
  • Abd-Shukor, Roslan
  • 2024-03
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
2023
Article

Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers

  • 2023-09
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)

  • Youn, Hee Jun
  • Lee, Jeong Il
  • Ha, Min Jeong
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2023-04
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler

  • 2023-04
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
2022
Article

Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites

  • 2022-05
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
2020
Article

Facile CuFeO2 microcrystal synthesis for lithium ion battery anodes via microwave heating

  • 2020-06
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
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