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자료 필터
자료유형
발행연도
2017 ~ 2026
2017 2026
키워드
언어
전체 39건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Thermomechanical Reliability of SAC/SB Mixed Solder Containing Sn-58Bi Eutectic Solder
- 백이현 ;
- 강승현 ;
- 김종민 ;
- 임병승
- 2026-08
- 대한용접접합학회지
- 대한용접접합학회
2025
Article
Effect of Sn-58Bi (SB) and Sn-3Ag-0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-12-22
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers
- Baek, Yi Hyeon ;
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-12-21
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-10-21
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Sn-58Bi 공정 솔더를 포함하는 SAC-SB 혼합 솔더의 기계적 접합 특성
- 정명진 ;
- 하이현 ;
- 박종문 ;
- 강승현 ;
- 김종민 ;
- ... 임병승
- 2025-04
- 대한용접접합학회지
- 대한용접접합학회
2024
Article
Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers
- Ha, Yi Hyeon ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2024-11
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
저융점/고융점 혼합 솔더 필러 함유 Solderable 이방성 고분자 복합 재료의 기계적 접합 특성
- 하민정 ;
- 정명진 ;
- 박종문 ;
- 최성우 ;
- 김종민 ;
- ... 임병승
- 2024-04
- 대한용접접합학회지
- 대한용접접합학회