상세 보기
자료 필터
자료유형
발행연도
2017 ~ 2026
2017 2026
키워드
언어
전체 39건 중 11번부터 20번까지의 결과를 표시합니다.
2024
Article
Mechanical Properties of Sn58Bi-Cu Composite Solder Filled with Copper Particles
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2024
- Materials Transactions
- JAPAN INST METALS & MATERIALS
2023
Article
Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers
- Ha, Min Jeong ;
- Lee, Jeong, II ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-09
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)
- Youn, Hee Jun ;
- Lee, Jeong Il ;
- Ha, Min Jeong ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-04
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler
- Ha, Min Jeong ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-04
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Mechanical Properties of Solderable Polymer Composites with Low- and High-Melting-Point Solder Mixed Filler
- Ha, Min Jeong ;
- Kim, Sangil ;
- Cho, Won Chul ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023
- Materials Transactions
- JAPAN INST METALS & MATERIALS
2022