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2017 ~ 2026
2017 2026
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전체 39건 중 21번부터 30번까지의 결과를 표시합니다.
2022
Article
저융점/고융점 합금 입자 함유 Solderable 고분자 복합 소재의 도전 경로 형성 특성
- 하민정 ;
- 김지호 ;
- 한재구 ;
- 양진석 ;
- 김종민 ;
- ... 임병승
- 2022-06
- 대한용접접합학회지
- 대한용접접합학회
Article
Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites
- Youn, Hee Jun ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2022-05
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2021
Article
Investigation of Bonding Mechanism for Cu-Powder Contained Solderable Epoxy-Solder Composites
- Youn, Hee Jun ;
- Kim, Sangil ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2021
- Materials Transactions
- JAPAN INST METALS & MATERIALS
2020
Article
Effect of dissolved-gas concentration on bulk nanobubbles generation using ultrasonication
- Lee, Jeong Il ;
- Yim, Byung-Seung ;
- Kim, Jong-Min
- 2020-11-02
- Scientific Reports
- NATURE PORTFOLIO
Article
탄소 나노튜브 함유량이 Solderable 등방성 및 이방성 도전성 접착제의 접합 특성 변화에 미치는 영향
- 임병승 ;
- 윤희준 ;
- 이정일 ;
- 김종민
- 2020-04
- 대한용접접합학회지
- 대한용접접합학회
Article
Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler
- Youn, Hee Jun ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2020
- Materials Transactions
- JAPAN INST METALS & MATERIALS
Article
Conduction Path Formation Mechanism of Solderable Polymer Composites with Low-Melting-Point Alloy/High-Melting-Point Alloy Mixed Filler
- Yim, Byung-Seung ;
- Lee, Jae Woo ;
- Kim, Jong-Min
- 2020
- Materials Transactions
- JAPAN INST METALS & MATERIALS
2019