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자료 필터
자료유형
발행연도
2000 ~ 2026
2000 2026
키워드
언어
전체 145건 중 61번부터 70번까지의 결과를 표시합니다.
2014
Article
Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads
- Kim, Hyung Giun ;
- Kim, Sang Min ;
- Lee, Jae Young ;
- Choi, Mi Ri ;
- Choe, Si Hyun ;
- ... Lim, Sung Hwan ;
- 외 5명
- 2014-02
- Acta Materialia
- PERGAMON-ELSEVIER SCIENCE LTD
Article
Microstructural characterization and thermodynamic analysis of precipitates in ultra-low-carbon bake hardened steel
- Lee, Taeg-Woo ;
- Kim, Sung-Il ;
- Hong, Moon-Hi ;
- Kim, Won-Yong ;
- Yoo, Young-Gyu ;
- ... Lim, Sung-Hwan
- 2014-01-05
- Journal of Alloys and Compounds
- ELSEVIER SCIENCE SA
2013
Conference
Micorstructural characterization and thermodynamic analysis of precipitates in ultra-low-carbon bake hardened steel
- 2013-11-28
- 대한민국
Conference
Microstructural characteristics of intermetallic compounds in Cu wire bonding with different pads by TEM
- 2013-11-28
- 대한민국
Conference
The mechanical properties of Cu-MWCNT compoiste fabricated by friction stir processing
- 2013-11-16
- 일본
Article
Stress-induced hexagonal close-packed to face-centered cubic phase transformation in commercial-purity titanium under cryogenic plane-strain compression
- Hong, D. H. ;
- Lee, T. W. ;
- Lim, S. H. ;
- Kim, W. Y. ;
- Hwang, S. K.
- 2013-09
- Scripta Materialia
- PERGAMON-ELSEVIER SCIENCE LTD